Origin: Mainland China
Material: Other
Pieces Included: 1
With Magnetic: No
Model Number: Laptop Copper Shim Thermal Pad
Total: 30PCS 0.3-1.5mm each 5PCS
Name: Laptop Copper Shim Thermal Pad
Product introduction: 6 Model Commonly Used Thickness Copper Shim
1model: 15*15*0.3mm
2model: 15*15*0.5mm
3model: 15*15*0.8mm
4model: 15*15*1.0mm
5model: 15*15*1.2mm
6model: 15*15*1.5mm
Apply to: BGA PCB repair Pick Up tools
30pcs/Lot Laptop Copper Shim Thermal Pad Heatsink Heat Sink Sheet For Notebook GPU CPU VGA Chip RAM Cooling 6 Model 0.3-1.5mm
6 Model Commonly Used Thickness Copper Shim
Packing list:
30PCS 0.3-1.5mm each 5PCS 5pcs* 15*15*0.3mm 5pcs* 15*15*0.5mm 5pcs* 15*15*0.8mm 5pcs* 15*15*1.0mm 5pcs* 15*15*1.2mm 5pcs* 15*15*1.5mm
Repair technicians who have repaired HP DV series notebooks all have the same feeling. As long as the repair rate of notebooks that use NF6150, NF7200, NF7300, G86 and other graphics cards is too high, after re-welding the graphics card, if luck is good, you can manage it for a month. It will be repaired after three days in bad times Some tricks to solve this problem are circulating on the Internet: 1. The graphics card will always be removed and replanted. If it does not work, replace the graphics card chip with a new one 2. Replace the heat dissipation pad on the graphics card GPU with copper of about 1MM 3. Change the fan to long rotation (fly the wire to the right USB interface power supply)
One effective method here is to install 0.8-1.5MM copper sheets
![](https://ae01.alicdn.com/kf/H870757bff9c54cc7afca3706a62b4cc57.jpg)
![](https://ae01.alicdn.com/kf/H28709c985b2347d9852535888b731c8aU.jpg)
Operation method:
Use a piece of red copper to replace the original blue thermal paste covering the GPU 1) The size of the copper sheet: length 1.5CM, width 1.5CM, thickness 0.8-1.5MM. 2) The copper sheet should be flat, not bend, and the surface should be as smooth as possible. 3) Operation sequence: A. Dismantling (search for pictures and dismantling instructions on the Internet) B. Use silver thermal silica gel to coat the contact surface of the GPU and above the copper sheet. There is no need to apply thermal silica gel under the copper sheet. C. Cover the GPU with the copper sheet, then cover the notebook's own heat dissipation module, and lock the screws. Please adjust the balance of the heat dissipation module appropriately to ensure that each chip and the heat dissipation module are in good contact, so that a good heat conduction effect can be exerted. Please pay attention to keep the graphics card core and the contact interface of the heat dissipation module parallel. The inclination of the contact surface causes uneven contact and affects the actual heat conduction effect D. Cover the north and south bridge chips on the other side of the motherboard with new blue thermally conductive adhesive to enhance heat dissipation. E. Restore the books. Be sure to clean up the dust on the fan/heat sink/heat sink module before replacing it. Inappropriate thickness can not exert a good heat conduction effect.
![](https://ae01.alicdn.com/kf/H7930375637444dad82d54e8e109c1cdfN.jpg)
![](https://ae01.alicdn.com/kf/H081cf70c62374508aba70c1828214e02M.jpg)